Smart devices are everywhere. There were an estimated 9.5 billion smart devices around the world in 2019—smashing projected targets of 8.3 billion.
A McKinsey Global Institute report predicts that by 2025, IoT sensor technology’s global economic impact will top $11.1 trillion per year.
IoT sensors: a rapidly growing ecosystem
IoT-powered smart devices are used in consumer electronics, defense, healthcare, and the industrial and automotive industries.
Based on the concept of “always-on” connectivity, IoT devices connect one user to another user, a user to a service provider, or a manufacturer to a service provider. New products with IoT capabilities have created whole new categories of “smart” products in the consumer electronics industry.
Effective IoT devices have excellent PCBs at their core
Integrating IoT capabilities differentiate manufacturers in a highly competitive market. For PCB engineers, they pose a design challenge.
IoT devices are typically small, compact, lightweight, and power-efficient. They look deceptively simple and sleek, but they pack a lot of functionality and high-tech specifications into a small space. At the heart of every IoT device, whether it powers wearable tech or industrial equipment, is a sophisticated piece of circuitry—the PCB or the printed circuit board.
Widespread IoT sensor integration drives PCB innovation. Traditional PCB design doesn’t accommodate IoT sensors. The rapidly growing IoT industry demands revision (and compliance) to new product specifications.
Rigid-flex & HDI PCBs in IoT designs
IoT devices present unique challenges for PCB engineers. Wearables, for example, require the following:
- Form flexibility to fit snugly on the body
- Durability to withstand the stresses of frequent usage
- New superfine material to keep the device lightweight
- User-friendly interfaces to interact via voice, touch, or gesture
- Low power consumption and high battery life for long usage times
This has put immense demands on PCB design engineers, giving more agile manufacturers more lucrative access to what has become a massive market.
Rigid-flex PCBs
A rigid-flex PCB is a hybrid circuit board that can be folded or flexed as required, to create ultra-thin wearable devices.
Engineers achieve PCB flexibility with a modular design—several smaller circuit boards join together to fit into the bends of flexible wearables instead of a single rigid board. PCBs are embedded into new-age, ultra-thin, and ultra-light materials to create smart wearables.
High-density Interconnect PCBs
High-density interconnect PCBs (HDIs) allow a concentrated arrangement of smaller components, which optimizes space on the board. These lightweight and compact boards are suitable for aerospace, military, as well as biomedical devices that require advanced functionality, connectivity, and reliability.
Custom PCB manufacturers use rigid-flex and HDI circuit technologies to optimize power consumption, reduce weight, and provides better battery life. Multiple layers, densely packed wiring, miniaturized vias, and coreless construction ensure design efficiency and faster production.
Design & Testing of IoT PCBs
MIS Electronics provides the infrastructure to support design, prototyping, manufacture, assembly, and testing of custom PCBs that power IoT devices.
Design
The successful design of an IoT device requires rapid, virtual prototyping and thorough testing to ensure high performance. Smart devices capture, analyze, and communicate data in real-time.
Smart device design engineers must consider several factors:
- Reliable connectivity protocols: Wi-fi, Bluetooth, 5G, etc.
- Reliable power source (100% uptime for mission-critical devices)
- Low-power consumption technology for consumer wearables
- High power consumption devices for industrial equipment
- Types of batteries for long-lasting battery life
- Flexible materials for light and less bulky devices
Testing
Design for Manufacturability (DFM) and Design for Testing (DFT)
are crucial steps in the IoT sensor technology process. DFM and DFT ensure faster time-to-market and reduce the risk of manufacturing defects.
Virtual prototyping tests cover all aspects of the device during design, like
optimal PCB size, circuit board layout, and type of material used to embed the PCB.
Tests are conducted at every stage of the product planning process and design phase. Any modifications made to the mechanical assembly of the device or to its circuit board design are also tested.
These processes ensure that mass-produced PCBs for IoT devices are efficient and deliver high performance. This is essential to the commercial success of the final product.
MIS Electronics provides customers with DFM analysis feedback prior to production to reduce production time and costs. Our PCB testing services are fast, accurate, and provide high-fault coverage.
MIS: At the forefront of IoT sensor technology
We design efficient IoT sensor technology solutions with a combination of custom PCB design and advanced cellular technologies, Wi-Fi, and Bluetooth protocols for connectivity. Our engineering and design teams can design GUI apps and interfaces using voice, gesture, or touch interaction.
Want to design high-power industrial equipment, power-efficient wearables, or update existing devices with non-contact, inductive charging? We have the infrastructure to manufacture your smart device successfully.
Take your product idea from build to reality with our high-quality manufacturing infrastructure. Get in touch with us today for a no-obligation quote